US, Japan reaching for a 2-nm chip breakthrough

Reports say two sides jointly aim to make leading-edge 2-nm chips by 2025 in state-led bid to hedge their mutual exposure to TSMC

A top-level meeting has confirmed earlier reports that the US and Japan will work together to develop leading-edge 2-nanometer (nm) semiconductor process technology to prevent overreliance on Taiwan Semiconductor Manufacturing Company’s (TSMC) factories in Taiwan.

On July 29, US Secretary of State Antony Blinken and Secretary of Commerce Gina Raimondo met with Japan’s Minister for Foreign Affairs Yoshimasa Hayashi and Minister of Economy, Trade and Industry Koichi Hagiuda in Washington, DC. It was the first meeting of the newly established US-Japan Economic Policy Consultative Committee.

A joint statement issued after the meeting said the two sides “seek to advance efforts under the Japan-US Commercial and Industrial Partnership and other frameworks to foster supply chain resilience in strategic sectors, including, in particular, semiconductors…”

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